Features & Benefits:
| Enables elimination of a second or third reflow cycle when temperature sensitive components or connectors are used.
Reduces energy consumption in reflow ovens versus standard lead free alloys.
Reduces reflow process cycle time.
Delivers 8 Hour stencil life.
Potential eliminations of bar solder, wave soldering flux and energy costs associated with wave soldering.
Compatible with all commonly used lead free surface finishes (Entek HT; Alpha Star Immersion Silver, Immersion Tin, Ni/Au, SACX HASL, etc.)
| Excellent resistance to random solder balling minimizing rework and increasing first time yield.
Low temperature reflow profiles may enable the use of less expensive printed circuit board substrates, when appropriate.
Meets highest IPC 7095 voiding performance (Class III).
Provides excellent electrical reliability properties.
Zero halogen (no halogen intentionally added) and halide-free material.
Compatible with either nitrogen or air reflow.