ALPHA® CVP-520 is designed to enable low temperature surface mount assembly technology. The lead-free alloy in ALPHA CVP-520 has a melting point below 140°C, and has been successfully used with peak reflow profiles between 155°C and 190°C. The flux residue from ALPHA CVP-520 is clear, colorless, and provides excellent electrical resistivity, exceeding industry standards. The carefully selected Sn/Bi/Ag alloy in ALPHA CVP-520 was selected to give the lowest melting point, lowest pasty range during melting and re-solidification, along with a very fine grain structure, offering maximum resistance to thermal cycle based fatigue. The alloy also yields very low voiding BGA solder joints, even when a traditional SAC alloy sphere is used.
ALPHA OM-385SM is designed for blend with Type 5 (15 – 25µm) powder to meet market segments requiring ultra-fine features application involving an air reflow environment. ALPHA OM-385SM is capable of providing excellent printing performance down to 180µm pad size dimension with a 60o angled squeegee on stencil at 50 mm/s speed, 2 mm/s release speed and 0.18 N/m pressure printing parameters. ALPHA OM-385SM is able to yield excellent coalescence performance for 180µm circle deposits using an air reflow high soak preheat as hot as of 170 – 180°C for 120s, >230°C for 62s, 247°C peak temperature. More importantly, it also has the ability to exhibit excellent Head-In-Pillow resistance performance. Best performance is achievable though with a low soak profile as illustrated in Fig 1.
SKU: OL-107FA SAC305
ALPHA OL-107F(A) is a lead-free, ZERO-halogen no-clean solder paste designed for applications where residue with excellent pin testing property and ability to pass JIS Copper Corrosion test are required. This product is also designed to enable consistent fine pitch printing capability, up to 200μm circle printed with 80μm thickness stencil. Its excellent print volume deposit repeatability also provides value by reducing defects associated with print process variability.
ALPHA CVP-520 is designed to enable low temperature surface mount assembly technology. The lead free alloy in ALPHA CVP-520 has a melting point below 140°C, and has been successfully used with peak reflow profiles between 155°C and 190°C. The flux residue from ALPHA CVP-520 is clear, colorless, and provides excellent electrical resistivity, exceeding industry standards. The use of ALPHA Exactalloy® performs may enable the elimination of selective wave soldering by providing additional solder volume when needed. All components used with ALPHA CVP-520 must be lead-free to eliminate the formation of tin/lead/bismuth intermetallic which has a melting point under 100ºC.
ALPHA WSX-ICP is a halide and halogen-free solder paste offering the ideal combination of printability and cleanability in a water-soluble lead-free alloy solder paste. ALPHA WSX-ICP was specifically formulated to address the emerging need to improve cleaning performance at lower water wash temperatures.
ALPHA CVP-525MSD is a low temperature solder paste technology designed to enable a single reflow application for assembly of double sided board. Its key attributes are excellent pipe printing performance with no-solder drip phenomena during the reflow process. ALPHA CVP-525MSD solder paste version with ALPHA SBX02 alloy, melting point below 140oC, has been successfully used with peak reflow profiles between 155oC and 190oC. ALPHA SBX02 alloy has improved Mechanical Strength and Drop Shock Resistance than the SnBi0.4Ag alloy. The flux residue from ALPHA CVP-525MSD provides excellent electrical resistivity, exceeding industry standards.
ALPHA OM-5300 is able to withstand long, hot soak reflow profiles, allowing better wetting of lead free surfaces with tin lead paste alloy. Very low BGA voiding, in conjunction with very high post reflow SIR readings make ALPHA OM-5300 ideal for tin lead soldering when lead free components are used. ALPHA OM-5300 is also a zero halogen product with no halogens intentionally added to the formulation.
OM-347 is designed for print and reflow with Type 4 and Type 5 powder for applications requiring ultra-fine feature performance. It has been formulated to enable excellent cleaning of residues after PCBs have been reflowed. Residues can be cleaned with industry leading cleaning chemistries and in a static bath using nPB solvents. OM-347 has an outstanding reflow process window that delivers good soldering on CuOSP with excellent coalescence on a broad range of deposit sizes, excellent random solder ball and mid-chip solder ball resistance.
SKU: WS693CPS SAC305 T4
ALPHA WS-693CPS is a solder paste designed for stencil application in surface mount processes. Its optimized solvent system improves the rolling property and printability. Also, the tack life increases to more than two times compared to conventional solder paste.