SKU: OM340(r)
ALPHA OM-340 (r) is a lead-free, no-clean solder paste designed for a broad range of applications. It provides best in class low defect rate for Head in Pillow defects combined with excellent first passyield on ICT/pin testing. ALPHA OM-340 (r) also yields excellent print capability performanceacross various board designs and, particularl y, with ultra-fine feature repeatabilit y and high “throughput” applications.Outstanding reflow process window delivers superior soldering on CuOSP with excellent coalescence on a broad range of deposit sizes, excellent random solder ball resistance and mid-chip solder ball performance. ALPHA OM-340 (r) is formulated to deliver excellent visual joint cosmetics and best in class in circuit pin test yields. Additionally, ALPHA OM-340 (r)’s capability of IPC Class III for voiding and ROL0 IPC classifications ensures maximum long-term product reliability.
SKU: OM340SL
ALPHAOM-340SL is a lead-free, zero-halogen no-clean solder paste designed for applications where residue with excellent pin testing property and ability to pass JIS Copper Corrosion test are required. This product is also designed to enable consistent fine pitch printing capability, down to 180µm circle printed with 100µm thickness stencil. Its excellent print volume deposit repeatability also provides value by reducing defects associated with print process variability. Additionally, ALPHA OM-340SL achieves IPC7095 Class III voiding performance.
SKU: OM353
ALPHA OM-353 is a low silver and SAC305 capable paste designed for Type 5 (15 to 25 µm) powder to meet market segments requiring ultra-fine features application. It has been tested to give excellent printing performance down to 180 µm pad size dimension with a 60° angled squeegee on stencil at 50 mm/s speed, 2 mm/s release speed and 0.18 N/m pressure printing parameters. ALPHA OM-353 is also available in Type 4 (20 to 38 µm) powder size distribution. ALPHA OM-353 has been shown to result in low Non-Wet-Open, Head-In-Pillow, Low Residue. Additional testing demonstrates there is low residue spread and low flux wicking.
SKU: OM340
ALPHA OM-340 is a lead-free, no-clean solder paste designed for a broad range of applications. It provides best-in-class low defect rate for head-in-pillow defects combined with excellent first pass yield on ICT/pin testing. ALPHA OM-340 also yields excellent print capability performance across various board designs and, particularly with ultra-fine feature repeatability and high “throughput” applications. An outstanding reflow process window delivers superior soldering on CuOSP with excellent coalescence on a broad range of deposit sizes and excellent random solder ball resistance and mid-chip solder ball performance. ALPHA OM-340 is formulated to deliver excellent visual joint cosmetics and best-in-class in circuit pin test yields. Additionally, ALPHA OM-340’s capability of IPC-7095 Class 3 for voiding and ROL0 IPC classifications ensures maximum long-term product reliability.
SKU: OL107SACX0307
ALPHA OL-107F(A) is a lead-free, ZERO-halogen no-clean solder paste designed for applications where residue with excellent pin testing property and ability to pass JIS Copper Corrosion test are required. This product is also designed to enable consistent fine pitch printing capability, up to 200μm circle printed with 80μm thickness stencil. Its excellent print volume deposit repeatability also provides value by reducing defects associated with print process variability. In addition, it has been innovated from flux chemistry perspective to address the challenge of achieving good coalescence, up to 200μm small circle size of CSP, and excellent IPC Class III ultra-low voids performance in an air reflow environment.
SKU: CVP520
ALPHA® CVP-520 is designed to enable low temperature surface mount assembly technology. The lead-free alloy in ALPHA CVP-520 has a melting point below 140°C, and has been successfully used with peak reflow profiles between 155°C and 190°C. The flux residue from ALPHA CVP-520 is clear, colorless, and provides excellent electrical resistivity, exceeding industry standards. The carefully selected Sn/Bi/Ag alloy in ALPHA CVP-520 was selected to give the lowest melting point, lowest pasty range during melting and re-solidification, along with a very fine grain structure, offering maximum resistance to thermal cycle based fatigue. The alloy also yields very low voiding BGA solder joints, even when a traditional SAC alloy sphere is used.
SKU: OM-385SM
ALPHA OM-385SM is designed for blend with Type 5 (15 – 25µm) powder to meet market segments requiring ultra-fine features application involving an air reflow environment. ALPHA OM-385SM is capable of providing excellent printing performance down to 180µm pad size dimension with a 60o angled squeegee on stencil at 50 mm/s speed, 2 mm/s release speed and 0.18 N/m pressure printing parameters. ALPHA OM-385SM is able to yield excellent coalescence performance for 180µm circle deposits using an air reflow high soak preheat as hot as of 170 – 180°C for 120s, >230°C for 62s, 247°C peak temperature. More importantly, it also has the ability to exhibit excellent Head-In-Pillow resistance performance. Best performance is achievable though with a low soak profile as illustrated in Fig 1.
SKU: OL-107FA SAC305
ALPHA OL-107F(A) is a lead-free, ZERO-halogen no-clean solder paste designed for applications where residue with excellent pin testing property and ability to pass JIS Copper Corrosion test are required. This product is also designed to enable consistent fine pitch printing capability, up to 200μm circle printed with 80μm thickness stencil. Its excellent print volume deposit repeatability also provides value by reducing defects associated with print process variability.
SKU: CVP-520
ALPHA CVP-520 is designed to enable low temperature surface mount assembly technology. The lead free alloy in ALPHA CVP-520 has a melting point below 140°C, and has been successfully used with peak reflow profiles between 155°C and 190°C. The flux residue from ALPHA CVP-520 is clear, colorless, and provides excellent electrical resistivity, exceeding industry standards. The use of ALPHA Exactalloy® performs may enable the elimination of selective wave soldering by providing additional solder volume when needed. All components used with ALPHA CVP-520 must be lead-free to eliminate the formation of tin/lead/bismuth intermetallic which has a melting point under 100ºC.
SKU: WSX-ICP
ALPHA WSX-ICP is a halide and halogen-free solder paste offering the ideal combination of printability and cleanability in a water-soluble lead-free alloy solder paste. ALPHA WSX-ICP was specifically formulated to address the emerging need to improve cleaning performance at lower water wash temperatures.
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