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Kester NP505-HR is a zero-halogen, lead-free, no-clean solder paste formula developed specifically for high reliability applications. NP505-HR has been formulated to have reliable residues even in harsh damp cycling SIR testing. NP505-HR can handle a wide variety of printer variables, including print speed and long idle times with a wide range of temperatures and humidities. NP505-HR is fully capable of printing and reflowing 01005 components in air reflow with minimal graping behavior. Post-soldering, NP505-HR offers minimized defects, including head-in-pillow and QFN/BGA voiding. This paste is zero-halogen, exceeding the IPC definition for halogen-free. NP505-HR is classified as ROL0 per IPC J-STD-004B. NP505-HR is part of Kester’s high reliability product line and compatible with no-clean RF550 Rework Flux, NF372-TB Solder Flux and SELECT-10™ Selective Soldering Flux.
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Kester NP545 is a zero-halogen, lead-free, no-clean solder paste formula designed for consistency and repeatability. NP545 is extremely stable and has an unrefrigerated shelf life of 12 months with no print or solderability degradation. NP545 consistently delivers paste transfer efficiencies of 0.55 to 0.5AR. The paste is also fully capable of printing and reflowing 01005 components, even in air reflow, with minimal graping behavior. NP545 is classified as ROL0 under IPC JSTD-004 and ROM0 under IPC JSTD-004B.
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Kester EM919G is a lead-free, halide-free, air and nitrogen reflowable, no-clean solder paste specifically designed for the thermal requirements of lead-free alloys, including SAC387 and SAC305. EM919G exhibits continual printability for fine pitch components (0.4mm/16mils) and is able to print at high speeds up to 6in/s (150mm/s). EM919G offers an excellent cosmetic appearance in the reflowed solder joints with smooth surfaces and light colored residues that closely resemble tin-lead solder joints. In addition, EM919G produces test probe friendly post soldering residues. EM919G is classified as ROL0 under IPC JSTD-004 and ROM0 under IPC JSTD-004B. Due to changes in REACH Regulations, this product is no longer sold into Europe or to European customers.
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NP560 is a no-clean, lead-free, halogen-free solder paste. It consistently delivers paste transfer efficiencies of 0.50 to 0.55 AR and is fully capable of printing and reflowing 01005 components, even in air, with minimal graping behavior. In addition to its stable, consistent product performance, NP560 has redefined the voiding standard for PCB assembly and has the potential for low voiding performance.
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