ALPHA HiTech Edgebond is a one component, heat curable material. It is an epoxy material to be dispensed on the corners or edges of the BGA. Upon deposition, minimal flow will take place beneath the BGA, to minimize contact with outer solder balls. The cured edgebond will help to strengthen the soldered assembled component so it can pass reliability tests such as Drop Shock, Impact Bend and Thermal Cycle (TCT).
ALPHA HiTech Edgebond end market is in portables such as Graphic Cards, Notebook, Tablets, as well as assembled boards in Automotive and Medical accessories.
ALPHA HiTech CF12-4485B is an excellent and effective low cost option to conventional underfilling process because higher material volume for capillary flow is not required.