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Manufactured by a special process that controls the inclusions of oxides and metallic and non-metallic impurities, Kester Ultrapure® is the industry standard bar solder for use in high tech electronic applications where lower surface tension and hole filling ability are essential. The purity of Ultrapure meets the requirements of IPC/J-STD-006C and will conform to these requirements when purchased directly or through stocking distributors.
SKU:
Manufactured by a special process that controls the inclusions of oxides and metallic and non-metallic impurities, Kester Ultrapure® is the industry standard bar solder for use in high tech electronic applications where lower surface tension and hole filling ability are essential. The purity of Ultrapure meets the requirements of IPC/J-STD-006C and will conform to these requirements when purchased directly or through stocking distributors.
SKU:
K100LD is a eutectic Tin/Copper alloy with controlled metallic dopants to control the grain structure within the solder joint, and to minimize the dissolution of copper into the solder pot. K100LD virtually eliminates the occurrence of common defects such as icicling and bridging. The improved grain structure also results in shinier solder joints than traditional lead-free alloy alternatives.
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