SKU: 268 Flux-Cored Wire
268 Flux-Cored Wire Kester 268 Flux-Cored Wire is a zero-halogen wire optimized for robotic soldering applications. With its unique chemistry system, 268 provides consistent workability performance for both robotic and manual soldering in the electronics industry, with performance equivalent to conventional halogen/ halide-based systems. 268 provides a clean release which prevents occurrences of bridges and protrusions, even in narrow-pitch automated drag soldering. The use of 268 results in a clear post-soldering residue without the need for cleaning. 268 is classified as Type ROL0 flux under J-STD-004B specifications. 268 is zero-halogen and halide-free with no intentional addition of bromine and chlorine, conforming to the strictest requirements of IEC 61249-2-21, JPCA-ES-01 and IPC-410B specifications.
SKU:
For soldering applications that require maximum reliability of solder joints, especially for surface mounted components, through hole and final assembly, only solder of the highest purity is acceptable. Kester does not make any vague claims of understanding solder purity. Only the highest quality metals are used to make Kester Solder Wire. Complete analysis of Kester Solder Wire prove that every batch conforms to the strictest quality controls in the solder industry.
SKU:
Kester 278 Flux-Cored Wire with Innolot Alloy is a halogen-free wire optimized for high performance applications, such as under-the-hood automotive. 278, with its fast wetting and low spattering, performs admirably when benchmarked against conventional halogen/halide-based systems, enabling its use in drag soldering and minimizing cycle time in robotic and manual soldering. The use of 278 results in a clear post-soldering residue without the need for cleaning. 278 is classified as Type ROL0 flux under J-STD-004B specifications. 278 is halogen-free and halide-free, conforming to the strictest requirements of IEC 61249-2-21, JPCA-ES-01 and IPC-410B specifications.
SKU:
952-D6 Flux-Pen® Kester 952-D6 Flux-Pen® is a no-clean, non-corrosive, halide-free Flux-Pen® that is specifically designed for lead-free rework of conventional and surface mount circuit board assemblies. Essentially no residue remains after soldering. 952-D6 was developed with a modified surface tension to aid in soldering boards that have surface mount and high component densities. This comprehensive formulation possesses improved wetting characteristics and also exhibits superior corrosion inhibiting properties and provides a non-tacky residue. A major advantage of this flux is the reduced odor associated with the soldering process. 952-D6 incorporates a small amount of rosin for higher reliability.
SKU:
Kester 951 is a zero-halogen, non-rosin flux designed for wave soldering, conventional and surface mount circuit board assemblies. The extremely low solids content (2.0%) and nature of the activator system results in practically no residue left on the assembly after soldering. Boards are dry and cosmetically clean as they exit the wave solder machine. There are no residues to interfere with electrical testing. 951 exhibits improved soldering performance to minimize solder bridges (shorts) and excessive solder defects. This flux is suitable for automotive, computer, telecommunications and other applications where reliability considerations are critical. The surface insulation resistance on soldered boards is higher than that provided by typical water-soluble fluxes. 951 contains a corrosion inhibitor such that no corrosion products are formed when bare copper surfaces are exposed to humid environments.
SKU:
Kester 2169 is a halide-free, organic flux that is designed for semiconductor component lead tinning and PCB soldering. This flux provides good activity on metals such as Nickel Iron (Alloy 42), nickel plate and copper alloy. Proper use of 2169 results in a non-porous solder coating in which a continuous, uniform metallurgical bond is formed with the base metal. The unique activity and surface tension properties of flux minimize soldering defects such as icicles, bridging, excessive solder or white residues in component dipping.
SKU:
Kester 2166-BN is a halide-free, organic flux designed for automated soldering of circuit board assemblies. This flux provides good activity on both bare copper and solder coated boards. The absence of chlorides, bromides, phosphates and highly corrosive materials facilitates removal after soldering. 2166-BN provides better surface insulation resistance than typical water-soluble fluxes, making it particularly suitable for surface mount assemblies. 2166-BN provides better chemical compatibility with solder resists than other water-soluble fluxes. It is free of volatile organic compounds. This eliminates the use of ozone depleting chemicals and volatile organic compounds contained in the flux removal solvents. 2166-BN flux produces bright, shiny solder joints and the residue after soldering is effectively removed in standard water cleaning systems.
SKU:
Kester 2120 is a halide-free, organic flux designed for automated soldering of circuit board assemblies. This flux provides good activity on both bare copper and solder coated boards. The absence of chlorides, bromides, phosphates and highly corrosive materials facilitates removal after soldering. 2120 produces bright, shiny solder joints and high ionic cleanliness after water cleaning. 2120 provides better surface insulation resistance than typical water-soluble fluxes, making it particularly suitable for surface mount assemblies. This flux does not attack properly cured solder resists or FR-4 epoxy-glass laminate. 2120 provides better chemical compatibility with solder resists than other water-soluble fluxes. No offensive odors or excessive smoke is emitted during soldering. 2120 will not create excessive foaming in standard water cleaning systems. 2120 is completely biodegradable for environmentally safe disposal of the wash water.
SKU:
Kester 1800 is a neutral, water-based, non-halide, organic acid flux formulated for soldering magnet wire. 1800 is non-flammable and because water is not a volatile solvent, it is easy to control in use. 1800 is water-soluble, which assures easy removal by aqueous cleaning methods after soldering. 1800 is used for soldering magnet wire, terminals ends, and electronic assemblies. The unique chemistry of 1800 allows it to remain active for a short period at very high temperatures, up to 500°C (932°F), to remove solderable magnet wire coatings. 1800 is an excellent flux for soldering copper that leaves virtually no residues at elevated temperatures.
SKU:
Kester NP505-HR is a zero-halogen, lead-free, no-clean solder paste formula developed specifically for high reliability applications. NP505-HR has been formulated to have reliable residues even in harsh damp cycling SIR testing. NP505-HR can handle a wide variety of printer variables, including print speed and long idle times with a wide range of temperatures and humidities. NP505-HR is fully capable of printing and reflowing 01005 components in air reflow with minimal graping behavior. Post-soldering, NP505-HR offers minimized defects, including head-in-pillow and QFN/BGA voiding. This paste is zero-halogen, exceeding the IPC definition for halogen-free. NP505-HR is classified as ROL0 per IPC J-STD-004B. NP505-HR is part of Kester’s high reliability product line and compatible with no-clean RF550 Rework Flux, NF372-TB Solder Flux and SELECT-10™ Selective Soldering Flux.
0985834121
