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952-D6 Flux-Pen® Kester 952-D6 Flux-Pen® is a no-clean, non-corrosive, halide-free Flux-Pen® that is specifically designed for lead-free rework of conventional and surface mount circuit board assemblies. Essentially no residue remains after soldering. 952-D6 was developed with a modified surface tension to aid in soldering boards that have surface mount and high component densities. This comprehensive formulation possesses improved wetting characteristics and also exhibits superior corrosion inhibiting properties and provides a non-tacky residue. A major advantage of this flux is the reduced odor associated with the soldering process. 952-D6 incorporates a small amount of rosin for higher reliability.
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Kester 951 is a zero-halogen, non-rosin flux designed for wave soldering, conventional and surface mount circuit board assemblies. The extremely low solids content (2.0%) and nature of the activator system results in practically no residue left on the assembly after soldering. Boards are dry and cosmetically clean as they exit the wave solder machine. There are no residues to interfere with electrical testing. 951 exhibits improved soldering performance to minimize solder bridges (shorts) and excessive solder defects. This flux is suitable for automotive, computer, telecommunications and other applications where reliability considerations are critical. The surface insulation resistance on soldered boards is higher than that provided by typical water-soluble fluxes. 951 contains a corrosion inhibitor such that no corrosion products are formed when bare copper surfaces are exposed to humid environments.
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Kester 2169 is a halide-free, organic flux that is designed for semiconductor component lead tinning and PCB soldering. This flux provides good activity on metals such as Nickel Iron (Alloy 42), nickel plate and copper alloy. Proper use of 2169 results in a non-porous solder coating in which a continuous, uniform metallurgical bond is formed with the base metal. The unique activity and surface tension properties of flux minimize soldering defects such as icicles, bridging, excessive solder or white residues in component dipping.
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Kester 2166-BN is a halide-free, organic flux designed for automated soldering of circuit board assemblies. This flux provides good activity on both bare copper and solder coated boards. The absence of chlorides, bromides, phosphates and highly corrosive materials facilitates removal after soldering. 2166-BN provides better surface insulation resistance than typical water-soluble fluxes, making it particularly suitable for surface mount assemblies. 2166-BN provides better chemical compatibility with solder resists than other water-soluble fluxes. It is free of volatile organic compounds. This eliminates the use of ozone depleting chemicals and volatile organic compounds contained in the flux removal solvents. 2166-BN flux produces bright, shiny solder joints and the residue after soldering is effectively removed in standard water cleaning systems.
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Kester 2120 is a halide-free, organic flux designed for automated soldering of circuit board assemblies. This flux provides good activity on both bare copper and solder coated boards. The absence of chlorides, bromides, phosphates and highly corrosive materials facilitates removal after soldering. 2120 produces bright, shiny solder joints and high ionic cleanliness after water cleaning. 2120 provides better surface insulation resistance than typical water-soluble fluxes, making it particularly suitable for surface mount assemblies. This flux does not attack properly cured solder resists or FR-4 epoxy-glass laminate. 2120 provides better chemical compatibility with solder resists than other water-soluble fluxes. No offensive odors or excessive smoke is emitted during soldering. 2120 will not create excessive foaming in standard water cleaning systems. 2120 is completely biodegradable for environmentally safe disposal of the wash water.
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Kester 1800 is a neutral, water-based, non-halide, organic acid flux formulated for soldering magnet wire. 1800 is non-flammable and because water is not a volatile solvent, it is easy to control in use. 1800 is water-soluble, which assures easy removal by aqueous cleaning methods after soldering. 1800 is used for soldering magnet wire, terminals ends, and electronic assemblies. The unique chemistry of 1800 allows it to remain active for a short period at very high temperatures, up to 500°C (932°F), to remove solderable magnet wire coatings. 1800 is an excellent flux for soldering copper that leaves virtually no residues at elevated temperatures.
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