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Encapsulant

Encapsulants are one component, intermediate temperature, fast heat curable materials. They are designed to mechanically protect the assembled chips and IC devices from dropping off and cracking.
 

Total 1 products.

EN21-4210F

SKU:

ALPHA HiTech EN21-4210F is a one-component epoxy system designed to encapsulate the chip component thus protecting the device and strengthening the solder joints.

0985834121

Zalo