KYZEN’s IONOX products are semi-aqueous and solvent cleaning chemistries designed to remove tough soils from electronic assembly and advanced packaging products.
IONOX I3302 is a semi-aqueous cleaning agent designed for cleaning the most challenging SMT Pb-free solder paste and tacky flux paste residues. This solution is also safe and effective for use on the newest Sn/Bi solder paste formulas. I3302 is highly effective at removing baked-on flux residues, which is particularly beneficial when cleaning lead frames, packages, and high-lead alloys. IONOX I3302 is designed for semi-aqueous centrifugal, spray under immersion, ultrasonic and mega-sonic tools, and should be rinsed with DI water or IPA.
IONOX FCR is a high-strength, concentrated cleaner containing a blend of organic solvents and inhibitors. FCR is engineered to remove organic acid, rosin and no-clean flux residues from electronic assemblies, advanced packages, hybrid and SMT substrates. IONOX FCR is used as received, in semi-aqueous centrifugal, spray under immersion, ultrasonic or mega-sonic tools, and should be followed with a water rinse to remove all traces of soils and cleaner residues from substrate surfaces.
IONOX BC is a semi-aqueous electronics cleaner made from a blend of organic solvents used in both manual stencil cleaning and under stencil wipe applications. IONOX BC is also commonly used for benchtop spot cleaning of reworked PCBs. As a legacy cleaning solution, IONOX BC is effective for removing virtually all types of solder pastes and fluxes including rosin, low residue/no-clean and organic acid, as well as flux core solder wire.