KYZEN’s MICRONOX products are semiconductor grade cleaning chemistries for defluxing and particulate removal for the Advanced Packaging, Microelectronics and Semiconductor industries.
MICRONOX MX2302 is an engineered semi-aqueous solvent blend designed to remove difficult flux and paste residues from wafer bumps found in die-attach, flip chip, copper pillar, and emerging semiconductor assemblies. MX2302 is used as received in all immersion cleaning systems including; semi-aqueous centrifugal, spray under immersion, ultrasonic and mega-sonic systems. MICRONOX MX2302 is compatible with all soldering materials and metal layers as well as materials of construction common in the production and cleaning of assemblies.
MICRONOX MX2501 is an engineered precision vapor cleaning solvent designed to be a drop-in replacement for modern era vapor degreasing equipment. MX2501 is effective in removing no-clean and rosin flux residues with superior performance characteristics over other fluorinated based cleaning solvents.
MICRONOX MX2708 is formulated for the demanding cleaning challenges presented within leadless devices such as low standoff gaps and fine pitch BGAs, flip chips, QFNs, LGAs, and passives. MX2708 completely removes organic acid residue of all kinds at low, safe operating concentrations all while having no effect on exposed metal and intermetallic alloys including Cu, Al, Sn, Pb, Ni, Ag, and Au finishes. MX2708 most effectively cleans organic acid flux residues at lower concentrations in spray-in-air cleaning systems.