Kester brings over 50 years of experience in preform manufacturing and can provide preforms in a variety of shapes, sizes, and flux types. Preforms can provide a precise volume of solder and flux to the right area at the right time for a number of different applications. The main applications include, but are not limited to, die attach, vacuum and hermetic seals and gaskets, PCB solder fortifications, connector pins and component attach, mechanical attachment, and thermal fuses. View the tables below to determine what sizes and flux types Kester offers and call a local sales representative today to inquire about technical questions and sample requests.
|291S||High Reliability Post Soldering Residue||NC||ORL0||X|
|290S||Extremely Low Residues||Low Solids||ROL0||X|
|285||Use for Difficult to Solder Applications||RMA||ROL0||X||X|
|48SF||High Activity RA Formulation with Excellent Wetting and Low Smoke and Odor||RA||ROL1||X|
|44||Recommended when Soldering to Highly Oxidized Copper or Difficult to Solder Applications||RA||ROM1||X||X|
|88||Highest Activity with ROM1 Type||RA||ROM1||X|
|435||High Activity Water Soluble Flux||WS||ORH1||X|