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Kester NP545 is a zero-halogen, lead-free, no-clean solder paste formula designed for consistency and repeatability. NP545 is extremely stable and has an unrefrigerated shelf life of 12 months with no print or solderability degradation. NP545 consistently delivers paste transfer efficiencies of 0.55 to 0.5AR. The paste is also fully capable of printing and reflowing 01005 components, even in air reflow, with minimal graping behavior. NP545 is classified as ROL0 under IPC JSTD-004 and ROM0 under IPC JSTD-004B.
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Kester EM919G is a lead-free, halide-free, air and nitrogen reflowable, no-clean solder paste specifically designed for the thermal requirements of lead-free alloys, including SAC387 and SAC305. EM919G exhibits continual printability for fine pitch components (0.4mm/16mils) and is able to print at high speeds up to 6in/s (150mm/s). EM919G offers an excellent cosmetic appearance in the reflowed solder joints with smooth surfaces and light colored residues that closely resemble tin-lead solder joints. In addition, EM919G produces test probe friendly post soldering residues. EM919G is classified as ROL0 under IPC JSTD-004 and ROM0 under IPC JSTD-004B. Due to changes in REACH Regulations, this product is no longer sold into Europe or to European customers.
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NP560 is a no-clean, lead-free, halogen-free solder paste. It consistently delivers paste transfer efficiencies of 0.50 to 0.55 AR and is fully capable of printing and reflowing 01005 components, even in air, with minimal graping behavior. In addition to its stable, consistent product performance, NP560 has redefined the voiding standard for PCB assembly and has the potential for low voiding performance.
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Manufactured by a special process that controls the inclusions of oxides and metallic and non-metallic impurities, Kester Ultrapure® is the industry standard bar solder for use in high tech electronic applications where lower surface tension and hole filling ability are essential. The purity of Ultrapure meets the requirements of IPC/J-STD-006C and will conform to these requirements when purchased directly or through stocking distributors.
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Manufactured by a special process that controls the inclusions of oxides and metallic and non-metallic impurities, Kester Ultrapure® is the industry standard bar solder for use in high tech electronic applications where lower surface tension and hole filling ability are essential. The purity of Ultrapure meets the requirements of IPC/J-STD-006C and will conform to these requirements when purchased directly or through stocking distributors.
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K100LD is a eutectic Tin/Copper alloy with controlled metallic dopants to control the grain structure within the solder joint, and to minimize the dissolution of copper into the solder pot. K100LD virtually eliminates the occurrence of common defects such as icicling and bridging. The improved grain structure also results in shinier solder joints than traditional lead-free alloy alternatives.
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