Description
ALPHA OM-340 is a lead-free, no-clean solder paste designed for a broad range of applications. It provides best-in-class low defect rate for head-in-pillow defects combined with excellent first pass yield on ICT/pin testing. ALPHA OM-340 also yields excellent print capability performance across various board designs and, particularly with ultra-fine feature repeatability and high “throughput” applications.
An outstanding reflow process window delivers superior soldering on CuOSP with excellent coalescence on a broad range of deposit sizes and excellent random solder ball resistance and mid-chip solder ball performance. ALPHA OM-340 is formulated to deliver excellent visual joint cosmetics and best-in-class in circuit pin test yields. Additionally, ALPHA OM-340’s capability of IPC-7095 Class 3 for voiding and ROL0 IPC classifications ensures maximum long-term product reliability.
Product Details
FEATURES & BENEFITS
- Maximizes reflow yield for lead-free processing, allowing full alloy coalescence at circular dimensions as small as 200 μm (8 mil) with 100 μm (4 mil) thick stencils
- Excellent print consistency with high process capability index across all board designs
- Print speeds of up to 150 mm/s (6 in/s), enabling a fast print cycle time and a high throughput
- Wide reflow profile window with good solderability on various board / component finishes
- Excellent solder and flux cosmetics after reflow soldering
- Best-in-class low defect rate for head-in-pillow
- Best-in-class in circuit pin test yield
- Reduction in random solderballing levels, minimizing rework, and increasing first time yield
- Meets highest IPC-7095 voiding performance classification of Class 3
- Excellent reliability properties, halide-free material
- Compatible with either nitrogen or air reflow
- Zero-halogen (No halogen intentionally added to the formulation)
