Alpha OM340(r)

Description

ALPHA OM-340 (r) is a lead-free, no-clean solder paste designed for a broad range of applications. It provides best in class low defect rate for Head in Pillow defects combined with excellent first passyield on ICT/pin testing. ALPHA OM-340 (r) also yields excellent print capability performanceacross various board designs and, particularl y, with ultra-fine feature repeatabilit y and high “throughput” applications.Outstanding reflow process window delivers superior soldering on CuOSP with excellent coalescence on a broad range of deposit sizes, excellent random solder ball resistance and mid-chip solder ball performance. ALPHA OM-340 (r) is formulated to deliver excellent visual joint cosmetics and best in class in circuit pin test yields. Additionally, ALPHA OM-340 (r)’s capability of IPC Class III for voiding and ROL0 IPC classifications ensures maximum long-term product reliability.

Product Details

FEATURES & BENEFITS

•  Maximizes reflow  yield for lead-free processing, allowing full alloy coalescence at  circular
dimensions as small as 200μm (8  mil)  with 100μm (4 mil) thick stencils
•  Excellent  print consistency  with high process  capability  index across all board designs
•  Print speeds  of up to 150mm/sec  (6”/sec),  enabling  a fast print cycle time and a high throughput
•  Wide  reflow profile window with good solderabilit y  on various  board / component  finishes
•  Excellent  solder and flux cosmetics  after reflow  soldering
•  Best in class low defect rate for Head in Pillow
•  Best in class in circuit pin test yield
•  Reduction  in random solderballing  levels,  minimizing  rework and increasing  first time yield
•  Meets highest  IPC 7095 voiding  performance  classification  of Class III
•  Excellent  reliabilit y  properties,  halide-free  material
•  Compatible  with either nitrogen or air reflow
•  Zero halogen  (No halogen intentionall y  added  to the formulation)