Description
ALPHA OM-353 is a low silver and SAC305 capable paste designed for Type 5 (15 to 25 µm) powder to meet market segments requiring ultra-fine features application. It has been tested to give excellent printing performance down to 180 µm pad size dimension with a 60° angled squeegee on stencil at 50 mm/s speed, 2 mm/s release speed and 0.18 N/m pressure printing parameters. ALPHA OM-353 is also available in Type 4 (20 to 38 µm) powder size distribution. ALPHA OM-353 has been shown to result in low Non-Wet-Open, Head-In-Pillow, Low Residue. Additional testing demonstrates there is low residue spread and low flux wicking.
Product Details
FEATURES & BENEFITS
- Long Stencil Life: up to 80 hours stencil life as tested per Alpha internal procedures, engineered for consistent performance in warm/humid production climates while reducing variations in print performance and paste dry-out
- High Tack Force Life: ensures high pick-and-place yields, good self-alignment
- Wide Reflow Profile Window: enables quality soldering of complex, high density PWB assemblies in an N2 environment, using high ramp rates and soak profiles as high as 170 °C to 180 °C
- Reduced Mid Chip Solder Balling, Head-in-Pillow minimizes rework and increases first time yield
- Excellent Solder Joint and Flux Residue Cosmetics: residue does not char or burn after reflow soldering, even when using long/high thermal soaking
- Excellent Voiding Performance: Pass IPC-7095 Class 3 classification for BGA
- Halogen Content: Zero Halogen, no halogen intentionally added
- Reliability: Pass JIS Copper Corrosion Test and all standard SIR Tests
- Safe and Environmentally Friendly: Materials comply with ROHS, TSCA, EINECS and Halogen-free requirements (Zero-halogen, see table below)
- Low-Silver alloy availability
