Description
ALPHA OL-107F(A) is a lead-free, ZERO-halogen no-clean solder paste designed for applications where residue with excellent pin testing property and ability to pass JIS Copper Corrosion test are required. This product is also designed to enable consistent fine pitch printing capability, up to 200μm circle printed with 80μm thickness stencil. Its excellent print volume deposit repeatability also provides value by reducing defects associated with print process variability. In addition, it has been innovated from flux chemistry perspective to address the challenge of achieving good coalescence, up to 200μm small circle size of CSP, and excellent IPC Class III ultra-low voids performance in an air reflow environment.
Product Details
FEATURES & BENEFITS
- Long Stencil Life: consistent performance for at least 6 hours of continuous printing without addition of new paste
- Long, High Tack Force Life: ensures high pick-and-place yields, good self-alignment and a low tomb-stoning defect rate
- Wide Reflow Profile Window: allows best quality solderability of complicated, high density PWB assemblies in both air and nitrogen reflow, using ramp and soak profiles, as high as 180 to 190°C
- Reduced Random Solder Ball Levels: minimizes rework and increases first time yield
- Excellent Coalescence and Wetting Performance: coalesced excellently at small circle level of <200µm, even at high soak profile environment
- Excellent Solder Joint and Flux Residue Cosmetics: after reflow soldering, even using long/high thermal soaking, without charring or burning
- Excellent Voiding Performance: Meets IPC7095 Class III Requirement
- Halogen Content: Zero Halogen
- Residue: Excellent Pin Testing property and Pass JIS Copper Corrosion Test
- Safe and Environmentally Friendly: Materials comply with ROHS and Halogen Free requirement, as well as TOSCA & EINECS. No toxic material used in the paste
