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ALPHA CVP-525MSD is a low temperature solder paste technology designed to enable a single reflow application for assembly of double sided board. Its key attributes are excellent pipe printing performance with no-solder drip phenomena during the reflow process. ALPHA CVP-525MSD solder paste version with ALPHA SBX02 alloy, melting point below 140oC, has been successfully used
with peak reflow profiles between 155oC and 190oC. ALPHA SBX02 alloy has improved Mechanical Strength and Drop Shock Resistance than the SnBi0.4Ag alloy. The flux residue from ALPHA CVP-525MSD provides excellent electrical resistivity, exceeding industry standards.