OM-347 is designed for print and reflow with Type 4 and Type 5 powder for applications requiring ultra-fine feature
performance. It has been formulated to enable excellent cleaning of residues after PCBs have been reflowed.
Residues can be cleaned with industry leading cleaning chemistries and in a static bath using nPB solvents.
OM-347 has an outstanding reflow process window that delivers good soldering on CuOSP with excellent
coalescence on a broad range of deposit sizes, excellent random solder ball and mid-chip solder ball resistance.
Features & Benefits
No-Clean & Ultra-Clean: OM-347 is a no-clean solder paste; residue resulted after the reflow process can be
safely left on board. If needed, the residue can be very easy cleaned with Aquanox A4241, Alpha BC-3350, or
nPB based solvents.
HIP performance: very good HIP performance, comparable with OM-340
High Tack Force Life: ensures high pick-and-place yields, good self-alignment
Long Stencil Life: engineered for consistent performance, reducing variations in print performance and paste
Wide Reflow Profile Window: enables quality soldering of complex, high density PCB assemblies in both air
Excellent Coalescence and Wetting Performance: coalesces well for down to 100µ using 50µ stencil, N2
reflow low soak profile environment
Excellent Solder Joint and Flux Residue Cosmetics: residue does not char or burn after reflow soldering,
even when using long/high thermal soaking
Excellent Voiding Performance: Pass IPC7095 Class III requirement for BGA.
Halogen Content: Zero-Halogen
Safe and Environmentally Friendly: Materials comply with ROHS, TOSCA, EINECS and Zero-Halogen