CVP-520MSD

Description

ALPHA CVP-520MSD is designed to enable low temperature surface mount assembly technology. The leadfree alloy in ALPHA CVP-520MSD has a melting point below 140°C, and has been successfully used with peak reflow profiles between 155°C and 190°C. The flux residue from ALPHA CVP-520MSD is clear & colorless.
The use of ALPHA Exactalloy performs may enable the elimination of selective wave soldering by providing additional solder volume when needed, especially when rectangular leads are inserted into round through holes.
All components used with ALPHA CVP-520MSD must be lead-free to eliminate the formation of tin/lead/bismuth intermetallic which has a melting point under 100ºC

Product Details

Feartures & Benefits:

• Enables elimination of a second or third reflow cycle when temperature sensitive components or connectors are used.
• Reduces energy consumption in reflow ovens versus standard lead free alloys.
• Reduces reflow process cycle time.
• Delivers 8+ Hour stencil life.
• Potential elimination of bar solder, wave soldering flux and energy costs associated with wave soldering.
• Compatible with all commonly used lead free surface finishes (Entek HT; Alpha Star Immersion Silver, Immersion Tin, Ni/Au, SACX HASL, etc.)
• Excellent resistance to random solder balling- minimizing rework and increasing first time yield.
• Low temperature reflow profiles may enable the use of less expensive printed circuit board substrates.
• Delivers very high in-circuit pin test yields, minimizing costly false negative test results.
• Compatible with either nitrogen or air reflow.
• Possess excellent solder drip resistance during reflow