CVP-525MSD-BC

Description

ALPHA CVP-525MSD-BC is a low temperature solder paste technology designed to enable a single reflow application for assembly of double sided board. Its key attributes are excellent pipe printing performance with no-solder drip phenomena during the reflow process. ALPHA CVP-525MSD-BC solder paste version with ALPHA SBX02 alloy, melting point below 140oC, has been successfully used
with peak reflow profiles between 155oC and 190oC. ALPHA SBX02 alloy has improved Mechanical Strength and Drop Shock Resistance than the SnBi0.4Ag alloy. The flux residue from ALPHA CVP-525MSD-BC provides excellent electrical resistivity, exceeding industry standards.

Product Details

Features & Benefits:

• Enables pipe printing without causing solder paste dripping and contaminating the reflow oven • Enables elimination of a 2nd or 3rd reflow cycle when temperature sensitive components or connectors are used • Reduces energy consumption in reflow ovens versus standard lead free alloys • Reduces reflow process cycle time • Potential elimination of bar solder, wave soldering flux and energy costs associated with wave soldering

• Compatible with all commonly used lead free surface finishes (Entek HT; Alpha Star Immersion Silver, Immersion Tin, Ni/Au, SACX® HASL, etc.) • Excellent resistance to random solder balling- minimizing rework and increasing first time yield • Low temperature reflow profiles may enable the use of less expensive printed circuit board substrates • Delivers very high in-circuit pin test yields, minimizing costly false negative test results • Compatible with either nitrogen or air reflow