ALPHA HiTech Adhesives & Encapsulants offer a full line of high performance adhesive, underfill, edgebond, and encapsulant materials. Designed for a wide range of applications including Automotive, Camera Modules, Mobile, Computing, White Goods Assemblies and LED assemblies.
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ALPHA HiTech CF12-4485B is an excellent and effective low cost option to conventional underfilling process because higher material volume for capillary flow is not required.
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ALPHA HiTech CF31-4010 is one component, high filler content, heat curable Edgebond suited for higher temperature / higher reliability environments..
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