SKU: M6314
METALNOX M6314 is a safe, all-purpose aqueous cleaner suitable for all spray cleaning and ultrasonic systems. M6314 is specifically designed to clean a broad range of both water-soluble and insoluble oils and removes oil, grease, emulsions as well as lubricants commonly used in metal industries. METALNOX M6314 is suitable for use on ferrous metals, non-ferrous metals, stainless steel, chrome, steel, aluminum, hard metals and HSS-parts.
SKU: M6319
METALNOX M6319 is a mild, alkaline aqueous cleaning concentrate used in immersion and spray-in-air cleaning equipment. M6319 when diluted is designed to remove a wide range of machining oils, coolants and general cutting, drawing compounds, forming fluids and hydrocarbon lubricants from steel, stainless steel and copper (alloys and plating). METALNOX M6319 is safe to use on Hastelloy, Inconel, magnesium, magnesium alloys, Monel, Ni-Cad plating, nickel alloys and titanium alloys.
SKU: M6093
METALNOX M6093 is a citric acid metal parts cleaning formulation designed to remove metal oxides, scale, rust, carbonaceous soils and other hard to remove industrial soils from metal parts. For use on a variety of metals, M6093 is a versatile product for cleaning in all immersion, spray and manual brush applications as well as descaling and passivation.
SKU: I3302
IONOX I3302 is a semi-aqueous cleaning agent designed for cleaning the most challenging SMT Pb-free solder paste and tacky flux paste residues. This solution is also safe and effective for use on the newest Sn/Bi solder paste formulas. I3302 is highly effective at removing baked-on flux residues, which is particularly beneficial when cleaning lead frames, packages, and high-lead alloys. IONOX I3302 is designed for semi-aqueous centrifugal, spray under immersion, ultrasonic and mega-sonic tools, and should be rinsed with DI water or IPA.
SKU: FCR
IONOX FCR is a high-strength, concentrated cleaner containing a blend of organic solvents and inhibitors. FCR is engineered to remove organic acid, rosin and no-clean flux residues from electronic assemblies, advanced packages, hybrid and SMT substrates. IONOX FCR is used as received, in semi-aqueous centrifugal, spray under immersion, ultrasonic or mega-sonic tools, and should be followed with a water rinse to remove all traces of soils and cleaner residues from substrate surfaces.
SKU: I-BC
IONOX BC is a semi-aqueous electronics cleaner made from a blend of organic solvents used in both manual stencil cleaning and under stencil wipe applications. IONOX BC is also commonly used for benchtop spot cleaning of reworked PCBs. As a legacy cleaning solution, IONOX BC is effective for removing virtually all types of solder pastes and fluxes including rosin, low residue/no-clean and organic acid, as well as flux core solder wire.
SKU: C141-R
CYBERSOLV 141-R is a non-flammable, solvent-based cleaning fluid designed for bench-top cleaning needs removing rosin, resin and synthetic polymeric flux residues from electronic circuitry. CYBERSOLV 141-R is ideally suited for cleaning through-hole and SMT electronic assemblies, connectors, cables and hybrid cables.
SKU: C8502
CYBERSOLV C8502 is specially formulated to quickly remove all types of flux residues from wave solder fingers, reflow oven surfaces and general electronics production equipment. C8502 is also effective on rosin flux used on fabrication of dissimilar metals on industrial components. CYBERSOLV C8502 is easy to use, non-flammable and virtually has no odor.
SKU: C8508
CYBERSOLV C8508 is an aqueous based cleaner for reflow ovens and general equipment maintenance. C8508 effectively removes adherent residues outgassed during the reflow-soldering step of surface mount assemblies that includes solder paste activators and functional additive build-up. CYBERSOLV C8508 is extremely effective at removing the toughest baked-on flux residues including the latest lead-free formulations.
SKU: MX2322
MICRONOX MX2302 is an engineered semi-aqueous solvent blend designed to remove difficult flux and paste residues from wafer bumps found in die-attach, flip chip, copper pillar, and emerging semiconductor assemblies. MX2302 is used as received in all immersion cleaning systems including; semi-aqueous centrifugal, spray under immersion, ultrasonic and mega-sonic systems. MICRONOX MX2302 is compatible with all soldering materials and metal layers as well as materials of construction common in the production and cleaning of assemblies.
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