ALPHA SOLDER

Alpha autoclean 40

SKU: autoclean 40

ALPHA AutoClean 40 is an aqueous flux removal fluid designed for use at full strength.

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ALPHA OM-340 (r) is a lead-free, no-clean solder paste designed for a broad range of applications. It provides best in class low defect rate for Head in Pillow defects combined with excellent first passyield on ICT/pin testing. ALPHA OM-340 (r) also yields excellent print capability performanceacross various board designs and, particularl y, with ultra-fine feature repeatabilit y and high “throughput” applications.Outstanding reflow process window delivers superior soldering on CuOSP with excellent coalescence on a broad range of deposit sizes, excellent random solder ball resistance and mid-chip solder ball performance. ALPHA OM-340 (r) is formulated to deliver excellent visual joint cosmetics and best in class in circuit pin test yields. Additionally, ALPHA OM-340 (r)’s capability of IPC Class III for voiding and ROL0 IPC classifications ensures maximum long-term product reliability.

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Alpha OM340SL

SKU: OM340SL

ALPHAOM-340SL is a lead-free, zero-halogen no-clean solder paste designed for applications where residue with excellent pin testing property and ability to pass JIS Copper Corrosion test are required. This product is also designed to enable consistent fine pitch printing capability, down to 180µm circle printed with 100µm thickness stencil. Its excellent print volume deposit repeatability also provides value by reducing defects associated with print process variability. Additionally, ALPHA OM-340SL achieves IPC7095 Class III voiding performance.

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Alpha OM353

SKU: OM353

ALPHA OM-353 is a low silver and SAC305 capable paste designed for Type 5 (15 to 25 µm) powder to meet market segments requiring ultra-fine features application. It has been tested to give excellent printing performance down to 180 µm pad size dimension with a 60° angled squeegee on stencil at 50 mm/s speed, 2 mm/s release speed and 0.18 N/m pressure printing parameters. ALPHA OM-353 is also available in Type 4 (20 to 38 µm) powder size distribution. ALPHA OM-353 has been shown to result in low Non-Wet-Open, Head-In-Pillow, Low Residue. Additional testing demonstrates there is low residue spread and low flux wicking.

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Alpha OM340

SKU: OM340

ALPHA OM-340 is a lead-free, no-clean solder paste designed for a broad range of applications. It provides best-in-class low defect rate for head-in-pillow defects combined with excellent first pass yield on ICT/pin testing. ALPHA OM-340 also yields excellent print capability performance across various board designs and, particularly with ultra-fine feature repeatability and high “throughput” applications. An outstanding reflow process window delivers superior soldering on CuOSP with excellent coalescence on a broad range of deposit sizes and excellent random solder ball resistance and mid-chip solder ball performance. ALPHA OM-340 is formulated to deliver excellent visual joint cosmetics and best-in-class in circuit pin test yields. Additionally, ALPHA OM-340’s capability of IPC-7095 Class 3 for voiding and ROL0 IPC classifications ensures maximum long-term product reliability.

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Alpha OL107SACX0307

SKU: OL107SACX0307

ALPHA OL-107F(A) is a lead-free, ZERO-halogen no-clean solder paste designed for applications where residue with excellent pin testing property and ability to pass JIS Copper Corrosion test are required. This product is also designed to enable consistent fine pitch printing capability, up to 200μm circle printed with 80μm thickness stencil. Its excellent print volume deposit repeatability also provides value by reducing defects associated with print process variability. In addition, it has been innovated from flux chemistry perspective to address the challenge of achieving good coalescence, up to 200μm small circle size of CSP, and excellent IPC Class III ultra-low voids performance in an air reflow environment.