SKU: WS693CPS SAC305 T4
ALPHA WS-693CPS is a solder paste designed for stencil application in surface mount processes. Its optimized solvent system improves the rolling property and printability. Also, the tack life increases to more than two times compared to conventional solder paste.
ALPHA’s OM-550 is a new low temperature chemistry paired with ALPHA’s HRL1 alloy. This alloy was designed to exhibit improved drop shock and thermal cycling performance versus existing low temperature alloys. Together, the flux and alloy blend to make a product that has the characteristics of a modern solder paste designed for motherboards but with the ability to reflow at lower temperatures therefore minimizing NWO and HIP defects in complex assemblies. All components used with ALPHA OM-550 must be lead-free to eliminate the formation of tin/lead/bismuth intermetallic which has a melting point under 100ºC.
ALPHA WSX-ICP is a halide and halogen-free solder paste offering the ideal combination of printability and cleanability in a water-soluble lead-free alloy solder paste. ALPHA WSX-ICP was specifically formulated to address the emerging need to improve cleaning performance at lower water wash temperatures.
ALPHA CVP-520MSD is designed to enable low temperature surface mount assembly technology. The leadfree alloy in ALPHA CVP-520MSD has a melting point below 140°C, and has been successfully used with peak reflow profiles between 155°C and 190°C. The flux residue from ALPHA CVP-520MSD is clear & colorless. The use of ALPHA Exactalloy performs may enable the elimination of selective wave soldering by providing additional solder volume when needed, especially when rectangular leads are inserted into round through holes. All components used with ALPHA CVP-520MSD must be lead-free to eliminate the formation of tin/lead/bismuth intermetallic which has a melting point under 100ºC
ALPHA CVP-525MSD-BC is a low temperature solder paste technology designed to enable a single reflow application for assembly of double sided board. Its key attributes are excellent pipe printing performance with no-solder drip phenomena during the reflow process. ALPHA CVP-525MSD-BC solder paste version with ALPHA SBX02 alloy, melting point below 140oC, has been successfully used with peak reflow profiles between 155oC and 190oC. ALPHA SBX02 alloy has improved Mechanical Strength and Drop Shock Resistance than the SnBi0.4Ag alloy. The flux residue from ALPHA CVP-525MSD-BC provides excellent electrical resistivity, exceeding industry standards.